Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...

In most cases, application of a connector has to do with soldering (except crimp and IDT connections). That is why one of the first questions I ask, when it comes to the connector choice is: What does ...

A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...

Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the ...

The objective of this article is to explain the best techniques for soldering sensors manufactured by Merit Sensor using automated equipment. All profiles must be assessed and tested for best ...